Our areas of application The areas of application for S-BOND® ultrasonic brazing are extensive and can be summarised as follows:
The areas of application for S-BOND® ultrasonic brazing are extensive and can be summarised as follows:
- Surface wetting/metallisation for contact soldering and melt adhesion
- Electronics transformers contact soldering, optical glasses, foams and sintered bodies
- Thermal management, lightweight structures, cooling plates, targets,
- Vacuum components, thin-film substrates, sensors, magnets, sintered metals,
- Semiconductor, solar, fibre optics,
- Metallisation for contacting (e.g. Al, Cu, glass)
- Repair and new part production
In addition, the application range of S-Bond also covers the following difficult-to-solder materials:
- Light metals (Al, Mg), titanium, non-ferrous metals, steels, stainless steels, chrome, copper, tin, zinc, sintered/porous materials
- Glasses (lead, soda), metallised glasses (e.g. ITO), ceramics, ceramic compounds, magnets,
- Superconductors, Semiconductors (e.g. germanium), silicon,
- Composite materials MMC/CMC (Al-SiC, Si-SiC), metal foaming.
