Ultrasonic solderable materials
The flux-free active solders, together with the ultrasonic effect, enable direct wetting of materials that are difficult to solder, e.g. of:
- Light metals (Al, Mg), titanium, non-ferrous metals, steels, stainless steels, chrome, copper, tin, zinc, sintered/porous materials
- Glasses (lead, soda), metallised glasses (e.g. ITO), ceramics, magnets,
- superconductors, semiconductors (e.g. germanium), silicon,
- Composite materials MMC/CMC (Al-SiC, Si-SiC), metal foams.
